Title: Next-generation Heterogeneous Communications: Capacity, Flexibility, and Efficiency
Speaker: Rui Zhang, Assistant Professor, State University of New York at Buffalo, USA
会议室：无线谷 A1319
时间：6月27日周四 14:30-15:30
Abstract: Heterogeneous optical and wireless communication networks are pivotal to meet the ever-growing demand of high-throughput data traffic and diverse application scenarios. Versatile methodologies and system interface architectures need to be developed to deliver multiple services in different user environments. Free space optics, photonics assisted millimeter wave, and coherent optical communication enable high-capacity links for wireless users and data center communications, respectively. Moreover, next-generation high-capacity communication systems add more requirements on many aspects including flexibility, hardware or data efficiency, as well as reliability. This talk will introduce novel key technologies that address these challenges including probabilistic shaping, multiple-spectra cooperation, data-efficient digital signal processing algorithm and hardware co- design, as well as reference signal design for integrated communication and sensing.
Bio: Rui Zhang is currently a Tenure Track Assistant Professor at the Electrical Engineering Department, State University of New York at Buffalo, USA. Rui Zhang received her PhD degree from the School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta USA in 2022. In 2017, she received her BS degree in Electrical engineering from Peking University, Beijing, China. Rui Zhang was the recipient of the 2022 Marconi Young Scholar Award, the Fall 2017 Oscar P. Cleaver Award from Georgia Tech, the 2018-2020 Corning Stem Scholarship, the Bell Labs Summer Intern Award for Outstanding Innovation, and top-scored paper in Optical Fiber Communication Conference 2022. From 2022 to 2023, she spent one year in MediaTek USA in San Diego, California USA, and conducted 6G wireless research. She also serves as an associate technical editor in IEEE Communication Magazine.
